为了进一步提高金属的硬度和强度,采用电铸工艺通过添加剂TN2提高阴极过电位,抑制晶粒生长,制备了超细晶镍钴合金层,研究了电流密度和添加剂TN2对铸层晶粒大小的影响.结果表明:提高电流密度可以细化晶粒,当电流密度从5 A/dm~2 增加到15 A/dm~2 时,晶粒大小从5μm 细化到500 nm;添加0.15 g/L TN2 时,铸层表面半光亮,晶粒进一步细化(小于500 nm),硬度高达60 HRC.
Ni-Co alloy coating was prepared by using electroforming technology. The effects of current density and additive TN2 on the grain size of the alloy coating were studied by means of scanning electron microscopy and X-ray diffraction. Results show that increasing current density leads to refined grains. As the current density increased from 5 A/dm~2 to 15 A/dm~2, the grain size decreased from 5μm to 500 nm. The alloy coating obtained in the presence of 0. 15 g/L additive TN2 had zero stress and semi-bright surface. And its gain size was smaller than 500 nm, while its hardness was as high as 60 HRC.
参考文献
| [1] | 桂枫,姚素薇.电镀纳米金属多层膜研究现状[J].电镀与环保,2000(01):3-5. |
| [2] | 赵阳培,黄因慧,张君伟,刘志东,田宗军,赵剑峰,花国然.脉冲射流电铸纳米晶铜的组织与性能[J].机械工程材料,2006(06):87-90. |
| [3] | 范爱玲,贺怀堂,田文怀,孙起.电铸超细晶材料的微观组织研究[J].太原重型机械学院学报,2003(02):88-91. |
| [4] | 方景礼.电镀添加剂理论与应用[M].北京:国防工业出版社,2006:1-15. |
| [5] | Clark D;Wood D;Erb U .Industrial applications of electrodeposited nanocrystals[J].Nano-Structured Materials,1997,9(08):755-758. |
| [6] | Lu L .High tensile ductility in nanocrystalline copper[J].Journal of Materials Research,2000,15(02):270-273. |
| [7] | 雷卫宁,朱荻.纳米晶精密电铸技术的研究[J].中国机械工程,2003(12):1065-1068. |
| [8] | D. Zhu;W. N. Lei;N. S. Qu;H. Y. Xu .Nanocrystalline electroforming process[J].CIRP Annals,2002(1):173-176. |
| [9] | 赵剑峰,黄因慧,吴安德.射流电沉积快速成形技术基础试验研究[J].机械工程学报,2003(04):75-78. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%