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光诱导沉积技术因具有可以不用屏蔽或遮盖也能使金属离子在材料表面沉积出各种图案的优点,而成为微电子领域和光伏领域替代传统丝网印刷技术制备选择性图案或者使图案金属化的方法.本文回顾了光解型和光生电子型光诱导沉积技术的发展历程,指出了存在的问题.认为镀液稳定性研究,防扩散层与基体结合力的提高,镀层机械性能和电气性能的改善,以新的镀种取代贵金属,以及产品寿命的延长,是今后的发展方向.

参考文献

[1] HALLIWELL M J;ZAHAVI J .Laser induced selective electroless plating[P].US,4681774,1987-07-21.
[2] SCHLESINGER M;PAUNOVIC M.Modern electroplating[M].New York:John Wiley and Sons,Inc,2000:510-511.
[3] ESROM H;KOGELSCHATZ U .Metal deposition with a windowless VUV excimer source[J].Applied Surface Science,1992,54:440-444.
[4] Esrom H. .Fast selective metal deposition on polymers by using IR and excimer VUV photons[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2000(1/4):1-4.
[5] Chen DS;Lu QH;Zhao Y .Laser-induced site-selective silver seeding on polyimide for electroless copper plating[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2006(3):1573-1580.
[6] SP(A)TH W .Verfahren zur galvanischen abscheidung einer metallschicht auf der oberfl(a)che eines halbleiterk(o)rpers[P].DE,2348182,1975-04-10.
[7] METTE A;SCHETTER C;WISSEN D.Increasing the efficiency of screen-printed silicon solar cell by light-induced silver plating[A].Waikoloa:IEEE,2006:1056-1059.
[8] WEFRINGHAUS E;PETRES R;HELFRICHT A.Electroless silver plating of screen printed front grid fingers as a tool for enhancement of solar cell efficiency[A].Milan:The Executive Committee of the EU PVSEC,2007
[9] GLUNZ S W;ALEMAN M;BARTSCH J.Progress in advanced metallization technology at Fraunhofer ISE[A].San Diego:IEEE,2008
[10] ALEM(A)N M;BAY N;BARUCHA D et al.Front-side metallization of silicon solar cells by nickel plating and light induced silver plating[J].Chemical Vapor Deposition,2009,100(02):412-417.
[11] FIORAMONTI A.Cell efficiency increase of 0.4% through light-induced plating[A].,2009:60-63.
[12] 陈智杨 .金属镀膜用于太阳能电池晶片应用[D].新竹:明新科技大学,2009.
[13] TUTASHKONKO S;KAMINSKI-CACHOPO A;BOULORD C.Copper light induced plating on silver screen-printed contacts of silicon solar cells[A].Valencia:The Executive Committee of the EU PVSEC,2010:2569-2572.
[14] KRAUSE A;BITNAR B;LENGSFELD C et al.Light-induced plating[P].US,2010/0108525,2010-05-06.
[15] HAMM G;JACQUES D L .Method of light-induced plating on semiconductors[P].US,2010/0003817,2010-01-07.
[16] BARTSCH J;RADTKE V;SCHETTER C et al.Electrochemical methods to analyse the light-induced plating process[J].Journal of Applied Electrochemistry,2010,40(04):757-765.
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