为了研究银浆的组成比例和烧结过程对银膜烧结后性能的影响，通过一系列的实验研究了不同配比的银粉、玻璃粉和有机载体配制成银浆并在不同烧结温度和保温时间下烧结对银膜附着力和方阻的影响。烧结银膜的形态用扫描电镜观察。结果表明，当银粉、玻璃粉和有机载体在银浆中的配比为80：5：15且银粉由球形银粉和片状银粉按1：1的比例制备的银浆在760℃烧结保温5min时性能较优。银膜的附着力和方阻分别为8.2 N和5.6 m?/□。
In order to study the effects of composition ratios of silver paste and the sintering process on the properties of the silver film after sintering, the effects of different ratios of silver powders, glass powders and organic carrier in silver paste and different sintering temperatures and holding time on the adhesion force and square resistance of the silver film were studied through a series of experiments. The morphology of the sintered silver film was observed by SEM. The results show that the silver film sintered at 760℃ for 5 minutes has better properties after sintering when the ratio of silver powders, glass powders and organic carrier in silver paste is 80:5:15 and the silver powders are composed of spherical silver powders and flake silver powders at the ratio of 1:1. The adhesion force and square resistance of the silver film are 8.2 N and 5.6 m?/□, respectively.
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