研究了铝硅合金基体化学镀Ni-Co-P镀层的工艺对镀层性能的影响.通过正交试验,得出镀液pH值、硫酸镍、硫酸钴以及次磷酸钠的含量对镀层厚度、硬度和成分的影响规律,发现增大镀液pH值和增加硫酸镍含量、次磷酸钠含量适中、降低硫酸钴含量,有利于增加镀层膜厚;增大镀液pH值、硫酸镍和次磷酸钠含量适中、降低硫酸钴含量,有利于提高镀层硬度.
The influence of electroless plating process parameters on the performances of Ni-Co-P coating on a hyper-eutectic Al-Si casting alloy is studied by orthogonal experiment. The effects of process parameters, such as pH and the component in electroless plating bath on the performance of Ni-Co P layer, such as the thickness and hard-ness,have been obtained. It is indicated that the thickness of Ni-Co P electroless plated layer increases with the increase of pH and the NiSO4 · 6H2O concentration, the moderate NaH2PO2 · H2O concentration, and the decreasing of the CoSO4· 7H2O concentration. The hardness of coating can be increased by increasing pH, using the moderate NiSO4 · 6H2O concentration and NaH2 PO2· H2O concentration, and decreasing the COSO2 · 7H2O concentration.
参考文献
| [1] | 刘国勤,李延祥.Ni-Co-P/SiC镀层和SiC表面金属化[J].腐蚀与防护,2002(09):381-383. |
| [2] | Liu WL;Chen WJ;Tsai TK;Hsieh SH;Chang SY .Effect of nickel on the initial growth behavior of electroless Ni-Co-P alloy on silicon substrate[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2007(8):3843-3848. |
| [3] | 杨二冰,王杰民.铝基体上化学镀Ni-Co-P的工艺研究[J].郑州大学学报（工学版）,2008(02):55-58. |
| [4] | <正交试验设计法编写组.正交试验设计法[M].上海:上海科学技术出版社,1979 |
| [5] | 宣天鹏,卑多慧.化学镀钴-镍-磷合金镀层沉积速度的探讨[J].电镀与涂饰,2000(02):6-9. |
| [6] | 宣天鹏,郑晓华,刘玉,邓宗钢.镍钴离子浓度比对化学镀Co-Ni-P合金组织结构和性能的影响[J].稀有金属,1998(02):111-115. |
| [7] | 宣天鹏,卑多慧.镀液pH值对化学镀Co-Ni-P合金镀层结构的影响[J].兵器材料科学与工程,2000(02):13-17. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%