通过调整镀液中Cu离子浓度和添加剂成分,得到了具有不同Cu含量的Ni-Cu-P三元镀层.使用SEM、XRD、DSC、电化学测试等设备和手段研究了镀层性能,总结了Cu含量对Ni-Cu-P镀层性能的影响.结果表明,Cu含量越高的镀层具有越小的沉积颗粒和越致密的镀层结构.Cu元素的加入会降低镀层中P的含量,增加镀层的有序度.极化曲线测试表明,由于镀层结构和化学组成的改变,Cu含量较高的镀层具有更低的孔隙率,更高的耐蚀性.交流阻抗测试证实了该结果,并表明随Cu含量增大,三元镀层的腐蚀行为随之变化.
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