低温共烧陶瓷(LTCC)是现代微电子封装中重要的研究分支,主要用于高速、高频系统.介绍了低温共烧陶瓷的发展历程及其中包含的若干重大研究热点,如铜布线工艺、收缩率匹配、LTCC散热等.
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