Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration

材料科学技术（英文）, 2014, 30(12): 1235-1242.

M.L.Huang ^1, , Z.J.Zhang ^2, , H.T.Ma ^3, , L.D.Chen ^4,

1.Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024, China

2.Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024, China

3.Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024, China

4.IC Packaging Department, Xi'an Institute of Microelectronic Technology, Xi'an 710600, China

基金项目: The authors gratefully acknowledge the financial support of the projects from the National Natural Science Foundation of China (Nos.51475072 and 51171036).

Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration

Keywords： Cu/Sn/Ni

参考文献

[1]	M. L. HUANG;S. M. ZHOU;L. D. CHEN .Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects[J].Journal of Electronic Materials,2012(4):730-740.
[2]	M.L. Huang;S. Ye;N. Zhao .Current-induced interfacial reactions in Ni/Sn–3Ag–.5Cu/Au/Pd(P)/Ni–P flip chip interconnect[J].Journal of Materials Research,2011(24):3009-3019.
[3]	Y.C. Hu;Y.H. Lin;C.R. Kao;K.N. Tu .Electromigration failure in flip chip solder joints due to rapid dissolution of copper[J].Journal of Materials Research,2003(11):2544-2548.
[4]	Y.H. Lin;Y.C. Hu;C.M. Tsai .In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing[J].Acta materialia,2005(7):2029-2035.
[5]	J.R.Cahoon .A modified "hole" theory for solute impurity diffusion in liquid metals[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,1997(3):583-594.
[6]	M.L. Huang;ZJ. Zhang;N. Zhao .A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/Cu interconnect during liquid-solid electromigration[J].Scripta materialia,2013(11):853-856.
[7]	M.L. HUANG;Q. ZHOU;N. ZHAO;Z.J. ZHANG .Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigration[J].Journal of Electronic Materials,2013(10):2975-2982.
[8]	X. GU;Y.C. CHAN .Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints[J].Journal of Electronic Materials,2008(11):1721-1726.
[9]	S.J.WANG;C.Y.LIU .Kinetic Analysis of the Interfacial Reactions in Ni/Sn/Cu Sandwich Structures[J].Journal of Electronic Materials,2006(11):1955-1960.
[10]	K.K. HONG;J.B. RYU;C.Y. PARK;J.Y. HUH .Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging[J].Journal of Electronic Materials,2008(1):61-72.
[11]	W.H. WU;H.L. CHUNG;C.N. CHEN;C.E. HO .The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples[J].Journal of Electronic Materials,2009(12):2563-2572.
[12]	L.D. Chen;M.L. Huang;S.M. Zhou .Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2010(2):535-541.
[13]	S.C.Hsu;S.J.Wang;C.Y.Liu .Effect of Cu Content on Interfacial Reactions between Sn(Cu)Alloys and Ni/Ti Thin-Film Metallization[J].Journal of Electronic Materials,2003(11):1214-1221.

上一张下一张

计量

下载量()
访问量()

作者相关

在本站搜索
M.L.Huang Z.J.Zhang H.T.Ma L.D.Chen
在百度学术搜索
M.L.Huang Z.J.Zhang H.T.Ma L.D.Chen
在万方数据库搜索
M.L.Huang Z.J.Zhang H.T.Ma L.D.Chen
在CNKI搜索
M.L.Huang Z.J.Zhang H.T.Ma L.D.Chen

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration

参考文献