为了提高铜线性能及其键合质量,采用拉力-剪切力测试仪、扫描电镜等研究了不同力学性能铜线及相应的键合参数对其键合质量的影响,分析了不同伸长率和拉断力、铜线表面缺陷、超声功率和键合压力对铜线键合质量的作用机制.结果表明：伸长率过小和拉断力过大会造成焊点颈部产生微裂纹,从而导致焊点的拉力和球剪切力偏低;表面存在缺陷的铜线其颈部经过反复塑性大变形会造成铜线表面晶粒和污染物脱落而出现短路和球颈部断裂;键合过程中键合压力过大能够引起的焊盘变形,同时较大的接触应力引起铝层溢出;过大的超声功率使键合区域变形严重产生明显的裂纹和引起键合附近区域严重的应力集中,致使器件使用过程中产生微裂纹而降低器件的使用寿命.
For improving the copper properties and bonding quality, the influence of different elongation, tensile strength, defects of copper surface, bonding power and bonding force on bonding quality is researched by pull strength-shear strength and scanning electron-microscopy (SEM).,The results show that the small elongation and high tensile strength can cause micro-crack, and the bonding strength and shear strength are too low. The repeated large plastic deformation will cause copper surface chip and contamination falling and cause short cir- cuit and crack. In bonding process, large bonding force can cause pad deformation, and high contact force can cause aluminum layer overflow. And the bonding area would deform and crack because of stress concentration caused by high bonding power, which would generate micro-crack in the using process and reduce the life of device
参考文献
| [1] | H. Saiki;Y. Marumo;H. Nishitake .Deformation analysis of Au wire bonding[J].Journal of Materials Processing Technology,2006(1/3):709-712. |
| [2] | S. Murali;N. Srikanth;Charles J. Vath III .Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding[J].Materials Characterization,2003(1):39-50. |
| [3] | 田春霞.电子封装用导电丝材料及发展[J].稀有金属,2003(06):782-787. |
| [4] | H. Gaul;H. Reichl;M. Schneider-Ramelow .Analysis of the friction processes in ultrasonic wedge/wedge-bonding[J].Microsystem technologies,2009(5):771-775. |
| [5] | 宋登元,宗晓萍,孙荣霞,王永青.集成电路铜互连线及相关问题的研究[J].半导体技术,2001(02):29-32. |
| [6] | 陈新,李军辉,谭建平.芯片封装中铜线焊接性能分析[J].电子机械工程,2004(05):18-21,28. |
| [7] | Z.W. Zhong;H.M. Ho;Y.C. Tan;W.C. Tan;H.M. Goh;B.H. Toh;J. Tan .Study of factors affecting the hardness of ball bonds in copper wire bonding[J].Microelectronic engineering,2007(2):368-374. |
| [8] | Li, J.;Liu, L.;Deng, L.;Ma, B.;Wang, F.;Han, L. .Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding[J].IEEE Electron Device Letters,2011(10):1433-1435. |
| [9] | 隆志力,韩雷,吴运新,周宏权.不同温度对热超声键合工艺连接强度的影响[J].焊接学报,2005(08):23-26,38. |
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