无压烧结SiC陶瓷(SSiC)是重要的高温结构材料,连接技术是扩大其应用范围的关键技术之一.将活性填料纳米Ni粉添加到聚硅氧烷SR355中制成连接材料,通过反应成形连接工艺连接SSiC.研究了纳米Ni粉对SR355的裂解过程和陶瓷产率的影响,同时也研究了填料含量和连接温度对连接件强度的影响.结果表明,纳米Ni粉的加入促进了SR355的裂解并提高了其陶瓷产率.当纳米Ni粉含量为1%(质量分数)、连接温度为1050℃时,连接件经3次浸渍增强处理后的连接强度达到最大值.微观结构研究表明,连接层均匀致密,且与母材间界面结合良好,界面处发生了元素的扩散,纳米Ni粉在连接过程中参与了化学反应并促进了界面结合.
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