采用DSC技术,研究不同热压温度制备的PTFE/SiO2复合材料以及纳米SiO2部分取代微米SiO2的PTFE/SiO2复合材料的非等温结晶行为.DSC分析表明热压温度高于370℃时,PTFE分子聚合度下降,晶态PTFE微观形貌发生改变,其性能恶化.对复合材料非等温结晶DSC曲线应用Avrami方程分析发现,结晶过程包含了均相成核和异相成核两种成核机理.纳米SiO2取代部分微米SiO2量小于0.25％时,对PTFE成核作用有一定提升,当取代量大于0.25％时,由于偶联剂用量一定,造成SiO2颗粒团聚以及与PTFE界面相容性变差,成核效果不明显.
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