利用有限元软件模拟WCu合金的熔渗过程.根据W颗粒骨架实际形貌,建立了球形颗粒堆积骨架模型;在等径与非等径多孔体系内部,分析了铜液在渗流路径中的压力及速度矢量分布;得出了当W粉平均粒度为5 μm时,铜液在多孔体系内部的熔渗深度与熔渗时间的关系,模拟结果与实验相符.
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