通过合金成分和变形工艺研究, 制备了一种高强度高导电性的形变Cu-Fe原位复合材料.实验结果表明, 铁含量越高, 强度越高, 导电性越低; 加入少量镁或锆, 可提高强度, 但同时损失导电性.在变形过程中, 加入适当的中间热处理, 在改变强度不太大的前提下, 能大大提高导电性.通过合理选择合金成分和变形工艺流程, 可制备不同强度和导电性等级要求的Cu-Fe原位复合材料.
参考文献
[1] | Bevk J;Harbison J P;Bell J L .Anomalous increase in strength of in situ formed Cu-Nb multifilamentary composites[J].Journal of Applied Physics,1978,49:6031-6038. |
[2] | Trybus C;Spitzig W A .Characterization of the strength and microstructural evolution of a heavily cold rolled Cu-20%Nb composite[J].Acta Materialia,1989,37:1971-1981. |
[3] | Verhoeven J D;Spitzig W A;Jones L L.Development of deformation processed copper-refractory metal composite alloys[J].Journal of Materials Engineering,1990(12):127-139. |
[4] | Raabe D;Heringhaus F;Hangen U et al.Investigation of a Cu-20 mass%Nb in situ composite part Ⅰ: fabrication[J].microstructure and mechanical properties,1995,86:405-415. |
[5] | Snoeck E;Lecouturier F;Thilly L et al.Microstructural studies of in situ produced filamentary Cu/Nb wires[J].Scripta Materialia,1998,38(11):1643-1648. |
[6] | Frommeyer G;Wassermann G .Microstructure and anomalous mechanical properties of in situ-produced silver-copper composite wires[J].Acta Materialia,1975,23:1353-1360. |
[7] | Asano T.;Sakai Y. .Cu-Ag wire pulsed magnets with and without internal reinforcements[J].IEEE Transactions on Magnetics,1994(4):2106-2109. |
[8] | S. T. Kim;P. M. Berge;J. D. Verhoeven .Deformation-Processed Copper-Chromium Alloys: Optimizing Strength and Conductivity[J].Journal of Materials Engineering and Performance,1995(5):573-580. |
[9] | Ellis T W;Kim S T;Verhoeven J D.Deformation-processed copper-chromium alloys:role of age hardening[J].Journal of Materials Engineering and Performance,1995(04):581-586. |
[10] | Funkenbusch P D;Courtney T H .Microstructural strengthening in cold worded in situ Cu-14.8%Fe composites[J].Scripta Metallurgica et Materialia,1981,15:1349-1354. |
[11] | Verhoeven J D;Chuen S C;Gibson E D .Strength and conductivity of in situ Cu-Fe alloys[J].Journal of Materials Science,1989,24:1748-1752. |
[12] | GO Y S;Spitzig W A .Strengthening in deformation-processed Cu-20%Fe composites[J].Journal of Materials Science,1991,26:163-171. |
[13] | Spitzig W A;Chumbley L S;Verhoeven J D et al.Effect of temperature on the strength and conductivity of a deformation processed Cu-20%Fe composite[J].Journal of Materials Science,1992,27:2005-2011. |
[14] | Jerman G A;Anderson I E;Verhoeven J D .Strength and electrical conductivity of deformation-processed Cu-15 vol pct Fe alloys produced by powder metallurgy techniques[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1993,A24:35-42. |
[15] | Biselli C;Morris D G .Microstructure and strength of Cu-Fe in situ composites obtained from prealloyed Cu-Fe powders[J].Acta Materialia,1994,42:163-176. |
[16] | C. BISELLI;D. G. MORRIS .MICROSTRUCTURE AND STRENGTH OF Cu-Fe IN SITU COMPOSITES AFTER VERY HIGH DRAWING STRAINS[J].Acta materialia,1996(2):493-504. |
[17] | BOLTAX A .Precipitation processes in copper-rich copper-alloys[J].Transactions of the Metallurgical Society of AIME,1960,218:812-821. |
[18] | Verhoeven J D;Downing H L;Chumbley L S et al.The resistivity and microstructure of heavily drawn Cu-Nb alloys[J].Journal of Applied Physics,1989,65:1293-1301. |
[19] | S.I. Hong;M.A. Hill .MICROSTRUCTURE AND CONDUCTIVITY OF Cu-Nb MICROCOMPOSITES FABRICATED BY THE BUNDLING AND DRAWING PROCESS[J].Scripta materialia,2001(10):2509-2515. |
[20] | Heringhaus F.;Schneider-Muntau HJ.;Gottstein G. .Analytical modeling of the electrical conductivity of metal matrix composites: application to Ag-Cu and Cu-Nb[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):9-20. |
[21] | PELTON A R;Laabs F C;Spitzig W A et al.Microstructural analysis of in-situ Cu-Nb composite wires[J].ULTRAMICROSCOPY,1987,22:251-265. |
[22] | S.I.Hong;M.A.Hill .Microstructural stability and mechanical response of Cu-Ag microcomposite wires[J].Acta materialia,1998(12):4111-4122. |
[23] | Sun Ig Hong;Mary Ann Hill .Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(1/2):189-197. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%