采用改性的单体反应物聚合法(MPMR)合成了一系列低黏度、耐高温异构聚酰亚胺树脂,研究了树脂预聚物分子质量对树脂的高温流变行为、固化后热氧化稳定性的影响,并对树脂的分子结构及其复合材料的加工工艺性能、力学性能进行了表征。结果表明:树脂预浸液常温储存期大于两个月,亚胺化后PI-2纯树脂最低黏度为154Pa·S,固化后树脂质量损失5%的温度大于560℃;石英纤维/PI-2树脂基复合材料在室温和500℃的弯曲强度分别为917、197MPa,弯曲模量分别为29、22GPa,拉伸强度分别为760、341MPa,拉伸模量分别为32、31GPa,压缩强度分别为570、95MPa,层间剪切强度分别为62、10MPa。
Low viscosity and high-temperature resistant isomeric polyimide resins were synthesized by modified polymerization of monomer reactants (MPMR) method. The effect of molecular mass on the rheology of oligmers and thermaloxidation stability of cured resins was studied. The molecular structure of polyimide resins, the processing and mechanical properties of their composites were characterized. The results show that the shelf life of resin solution is more than two months. The lowest viscosity of PI - 2 resin after imidization is 154 Pa s. The temperature for 5% mass loss of cured resins is higher than 560 ℃. The flexural strength and flexural modulus of quartz fabric/PI- 2 composite at room temperature and 500 ℃ are 917 MPa, 197 MPa and 29 GPa, 22 GPa, respectively. The tensile strength and tensile modulus at room temperature and 500 ℃ are 760 MPa, 341 MPa and 32 GPa, 31 GPa, respectively. The compressive strength at room temperature and 500 ℃ is 570 MPa, 95 MPa respectively. The interlaminar shear strength at room temperature and 500 ℃ is 62 MPa and 10 MPa, respectively.
参考文献
[1] | Meador M A. Recent advances in the development of processable high-temperature polymer [J]. Annu Rev Mater Sci, 1998, 28: 599-630. |
[2] | 李 敏, 张佐光, 仲伟虹, 等. 聚酰亚胺树脂研究与应用进展 [J]. 复合材料学报, 2000, 17(4): 48-53. |
[3] | 丁孟贤. 聚酰亚胺: 化学、结构与性能的关系及材料 [M]. 北京: 科学出版社, 2006: 591-613. |
[4] | Ding M X. Isomeric polyimides [J]. Prog Polym Sci, 2007, 32(6): 623-668. |
[5] | Wilson D. PMR-15 processing, properties and problems-A review [J]. Brit Polym J, 1988, 20(5): 405-416. |
[6] | Serafini T T, Delvigs P, Lightse G R. Thermally stable polyimides from solutions of monomeric reactants [J]. J Appl Polym Sci, 1972, 16(4): 905-915. |
[7] | Vannucci R D. PMR polyimide compositions for improved performance at 371 ℃ [J]. SAMPE J, 1987, 19(1): 31-36. |
[8] | Florence M, Loustalot G, Billon L. Chemical structure/mechanical properties of para-aminostyrene(PAS)-terminated telechelic polyimides [J]. Polymer, 1998, 39(10): 1815-1831. |
[9] | Scola D A, Wai M. The thermo-oxidative stability of fluorinated polyimides and polyimides/graphite composites at 371 ℃ [J]. J Appl Polym Sci, 1994, 52(3): 421-429. |
[10] | Chuang K C, Bowman C L, Tsotsis T K, et al. 6F-polyimides with phenylethynyl endcap for 315-370 ℃ applications [J]. High Perform Polym, 2003, 15: 459-472. |
[11] | 王 震, 杨慧丽, 益小苏, 等. 苯炔基封端的联苯型聚酰亚胺复合材料 [J]. 复合材料学报, 2006, 23(3): 1-4. |
[12] | Hergenrother P M, Connell J W, Smith J G, et al. Phenylethynyl containing imide oligomers [J]. Polymer, 2000, 41(13): 5073-5081. |
[13] | Hergenrother P M. Composites for high speed civil transports [J]. SAMPE J, 1999, 35(1): 30-32. |
[14] | Yokota R, Yamamoto S, Yano S, et al. Molecular design of heat resistant polyimides having excellent processability and high glass transition temperature [J]. High Perform Polym, 2001, 13: 61-72. |
[15] | Hergenrother P M. The use, design, synthesis and properties of high performance/high temperature polymers: An overview [J]. High Perform Polym, 2003, 15: 3-45. |
[16] | Ogasawara T, Ishida Y, Yokota R, et al. Processing and properties of carbon fiber/triple-A polyimide composites fabricated from imide oligmer dry prepreg [J]. Composites Part A, 2007, 38(5): 1296-1303. |
[17] | 刘 相, 谢 凯, 洪晓斌. 利用时温等效原理修正的VARTM用双酚F型环氧树脂体系化学流变模型 [J]. 复合材料学报, 2010, 27(1): 1-6. |
[18] | 刘志真, 李宏运, 邢 军, 等. RTM 聚酰亚胺复合材料力学性能研究 [J]. 材料工程, 2007(S1): 98-101. |
[19] | 刘志真, 李宏运, 邢 军, 等. RTM 聚酰亚胺树脂性能优化设计研究 [J]. 材料工程, 2007(S1): 80-84. |
[20] | 王 震. 苯炔基封端的异构聚酰亚胺树脂//郭玉明. 复合材料—基础、创新、高效: 第十四届全国复合材料学术会议论文集. 北京: 中国宇航出版社, 2006: 252-253. |
[21] | 孟祥胜, 杨慧丽, 范卫锋, 等. 高韧性异构聚酰亚胺树脂及其复合材料 [J]. 宇航材料工艺, 2009, 39(3): 53-57. |
[22] | 王 震. 2, 3, 3', 4'-苯四甲二酐及其衍生物的制备方法: 中国, 03105026.3 . 2005-08-17. |
[23] | 王 震. 4-苯乙炔苯酐的制备方法: 中国, 200310115829.8 . 2006-05-31. |
[24] | 刘 丽. 天线罩用透波材料 [M]. 北京: 冶金工业出版社, 2008: 3. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%