采用机械球磨法制备片状银粉,通过扫描电镜(SEM)、激光粒度分析仪和热重分析仪表征了银粉的形貌、粒度及纯度,研究球磨介质、球磨时间以及球磨前驱体球形银粉的形貌对片状银粉形貌及粒度的影响。结果表明,以乙醇为球磨介质,球磨时间为15 h,并采用粒径均一的球形银粉为球磨前驱体,能够机械球磨制备片状率高,粒径大小在4~6μm且均匀的片状银粉。将片状银粉配制成银胶,印刷并固化成线路后,测试了其电导率,达到了应用指标。
The flake silver powders were prepared by mechanical ball milling, and then characterized by the scanning electron microscopy (SEM), thermo-gravimetric analyzer and laser particle size analyzer. Effects of preparative conditions on the physical performance of resulting flake silver powders were also investigated. The flake silver powders with a high flaky rate and an even particle size of 4~6 μm could be prepared, when ethanol was used as the milling medium, milling time was 15 h and the spherical silver powders with an even particle size were chosen as a precursor. Finally, the flake silver powders were fabricated into conductive adhesive according to the formulation and solidified to an electronic circuit. Its electrical conductivity conformed to the application standard.
参考文献
[1] | Ogunjimi A O;Boyle O;Whalley D C et al.A review of the impact of conductive adhesive technology on interconnection[J].JOURNAL OF ELECTRONICS MANUFACTURING,1992,2(03):109-118. |
[2] | Wong C P;Lu D;Meyers L.Fundamental study of electrically conductive adhesives(ECAs)[A].,1997:80-85. |
[3] | Lee Y C;Williams P M .Solderless connection technologies[J].Manufact Aspects Electron Packag,1993,65:71-71. |
[4] | Jagt J.C.;Beris P.J.M.;Lijten G.F.C.M. .Electrically conductive adhesives: a prospective alternative forSMD soldering?[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1995(2):292-298. |
[5] | Harris P G .Conductive adhesives:a critical review of progress to date[J].SOLDERING & SURFACE MOUNT TECHNOLOGY,1995,7(2):19-26. |
[6] | Zwolinski M.;Hickman J. .Electrically conductive adhesives for surface mount solder replacement[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology.Part C.Manufacturing,1996(4):241-250. |
[7] | 梁焕珍,金东镇,喻克宁,郑宪生,张洁,黎少华,李锐星.六方片状银粉的合成[J].粉末冶金技术,2003(04):218-223. |
[8] | Sihai Chen;Zhiyong Fan;David L. Carroll .Silver Nanodisks: Synthesis, Characterization, and Self-Assembly[J].The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical,2002(42):10777-10781. |
[9] | Sihai Chen;David L. Carroll .Silver Nanoplates: Size Control in Two Dimensions and Formation Mechanisms[J].The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical,2004(18):5500-5506. |
[10] | 谭富彬,赵玲,刘林,李茜.片状银粉的特性及其电性能[J].贵金属,1999(02):10-15. |
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%