本文利用傅立叶变换红外光谱技术(FTIR)及正电子湮没谱技术(PAS)对快中子辐照硅中的双空位(V2)的退火行为作了详细研究.研究发现区熔硅中双空位在250 ℃热处理会通过相互连接形成链状而在红外光谱中消失,提高退火温度到350～450 ℃,它们将进一步结合形成具有三维结构的四空位型缺陷;而在直拉硅中双空位主要通过捕获间隙氧或A中心(VO)形成V3O复合体而消失.
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