目的得到一种低温快速固化的潜伏性双氰胺固化剂。方法利用红外光谱对合成的新型双酚A型酚醛树脂改性双氰胺潜伏性固化剂的结构进行表征,研究双氰胺和酚醛不同配比对固化漆膜性能的影响,采用示差扫描量热( DSC)分析研究改性后固化剂的活性、用量及固化温度。结果双氰胺和酚醛较好的摩尔比为0.6：1,改性固化剂的最佳用量为30%(相对环氧树脂的质量分数),改性后的恒温固化温度为127℃。结论该配方合成的双酚A型酚醛树脂改性双氰胺固化剂具有最好的综合性能。
ABSTRACT:Objective To obtain a latent, low-temperature and fast curing dicyandiamide agent. Methods A new latent curing agent of dicyandiamide modified by bisphenol A type phenolic aldehyde resin was synthesized and the structure was characterized by FTIR spectra. The impact of dicyandiamide dosage on product performance was investigated. The activity of the modified curing a-gent, the dosage and the curing temperature were studied with differential scanning calorimetry ( DSC) . Results The results showed that the suitable molar ratio of dicyandiamide and phenolic aldehyde was 0. 6 : 1, the optimal dosage of the modified curing agent was 30% ( relative to the epoxy resin mass fraction) , and the constant curing temperature after modification was 127 ℃. Conclu-sions The resulting curing agent of bisphenol A phenolic resin modified dicyandiamide exhibited the best comprehensive perform-ances.
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