通过外向法制备纳米Ag颗粒/In - 3Ag复合焊料,研究在多次回流过程中,添加不同含量的纳米Ag颗粒对In - 3Ag焊料焊点基体组织和界面IMC层(intermetallic compound)的影响规律,采用SEM、HRTEM、能量色散仪( EDS)和电子探针(EPMA)分别对焊点基体及IMC层的微观结构及成分进行观察和分析.研究结果表明:纳米Ag颗粒能诱发晶粒成核,多次回流后,复合焊料基体中颗粒状二次相AgIn2没有明显长大现象；通过塞积扩散通道和表面吸附效应,纳米Ag颗粒能显著抑制焊料界面IMC层在多次回流过程的生长；纳米Ag颗粒的合适添加量为0.5％(质量分数,下同),当添加1％时,颗粒团聚,导致界面处出现球形AgIn2,降低焊料的力学性能.
参考文献
| [1] | 马运柱,李永君,刘文胜.纳米颗粒增强无铅复合焊料的研究现状[J].电子元件与材料,2011,30(6):79-83.Ma Yunzhu, Li Yongjun, Liu Wensheng. Research development of nano-composite lead-free solders[J].Electronic Components and Materials,2011,30(6):79-83. |
| [2] | Shi Y W,Liu J P,Xia Z D,et al.Creep property of composite solders reinforced by nano-sized particles[J].J Mater Sci:Mater Electron,2008,19(4):349-356. |
| [3] | Guo F, Choi S, Lucas J P, et al. Microstructural characterisation of reflowed and isothermal-aged Cu and Ag particulate reinforced Sn-3.5 Ag composite solders[J].Soldering & Surface Mount Technology,2001,13(1):7-18. |
| [4] | Tai F,Guo F,Xia Z D,et al.Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints [J], International Journal of Minerals,Metallurgy and Materials,2009,16(6):677-684. |
| [5] | Tai F,Guo F,Xia Z D,et al.Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions [J]. Journal of Electronic Materials,2005,34(11):1357-1362. |
| [6] | Shi Y W, Liu J P, Xia Z D, et al. Study on creep characterization of nano-sized Ag particles-reinforced Sn-Pb composite solder joints[J].J Mater Sci: Mater Electron,2010,21(3):256-261. |
| [7] | Gain A K, Chan Y C, Sharif A, et al. Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages[J].Microelectronic Reliability,2009,49(7):746-753. |
| [8] | Liu Y M,Chuang T H.Interfacial reactions between In10Ag solders and Ag substrates [J]. Journal of Electronic Materials,2000,29(11):1325-1332. |
| [9] | Reynolds H L,Kang S H,Morris J W.The ceep behavior of In-Ag eutectic solder joints[J]. Journal of Electronic Materials,1999,28(1): 69-75. |
| [10] | 刘彬,邰枫,郭福.纳米结构强化的新型Sn-Ag基无铅复合钎料[J].材料工程,2009(8):38-42.Liu Bin,Tai Feng,Guo Fu.Research of new Sn-Ag based lead-free composite solders containing nano-structured reinforcements[J].Journal of Materials Engineering,2009(8):38-42. |
| [11] | Tsao L C.Suppressing effect of 0.5wt％ nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging[J].Journal of Alloys and Compounds,2011,509(33):8441-8448. |
| [12] | Chuang T H,Jain C C,Wang S S.Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and InAg surface finishes[J]. Journal of Materials Engineering and Performance,2009,18(8):1133-1139. |
| [13] | Shen J,Liu Y C,Han P Z,et al.Formation of bulk intermetallic compound Ag3Sn in slowly-cooled lead-free Sn-4.0wt％Ag solders[J].Journal of Materials Science & Technology,2005,21(6):1-4. |
| [14] | Babaghorbani P,Nai S M L,Gupta M.Integrating copper at the nanometer length scale with Sn-3.5Ag solder to develop high performance nanocomposites[J].Materials Science and Technology,2009,25(10):1258-1264. |
| [15] | 上官东恺.无铅焊料互联与可靠无铅焊料互联与可靠性性[M].刘建影,孙 鹏,译,北京:电子工业出版社,2008:61-62.Shangguan Dongkai.Lead-free solder interconnect reliability[M]. Liu Jianying,Sun Peng,trans. Beijing:Publishing House of Electronics Industry,2008:61-62. |
| [16] | Arafat M M, Haseeb A S M A. Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7 Cu-nano Mo composite solder[C]// 2009 11th Electronics Packaging Technology Conference,IEEE Reliability/CPMT/ED Singapore Chapter.Singapore:IEEE,2009:953-956. |
| [17] | Zhai Q J,Guan S K,Shang G Y.Alloy thermo-mechanism theory and application[M]. Beijing:Metallurgy Industry Press,1999:156-160. |
| [18] | Shen J,Liu Y C,Han Y J,et al.Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead free solder[J].J Electron Mater,2006,35:1672-1679. |
| [19] | 于大全,段莉蕾,赵杰,等.Sn-3.5Ag/Cu界面金属间化合物的生长行为研究[J].材料科学与工艺,2005,13(5):532-536.Yu Daquan,Duan Lilei,Zhao Jie,et al.The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate[J].Materials Science & Technology,2005,13(5):532-536. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%