欢迎登录材料期刊网

材料期刊网

高级检索

随着微电子封装领域中合金的使用,润湿性问题已成为封装可靠料学、材料物理、测试科学技术等基础研究领域.综述了目前合金润湿性的常用测量方法,着重介绍了润湿平衡法,最后利用基片曲率法,提出一种新的光学方法来实时测量合金润湿性.

参考文献

[1] K. N. Tu;A. M. Gusak;M. Li .Physics and materials challenges for lead-free solders[J].Journal of Applied Physics,2003(3):1335-1353.
[2] RichardsP et al.An Analysis of the Current Status of Lead-Free Soldering NPL report[OL].http://www:npl: co: uk/npl/ei/documents/pbfreereport pdf,1999.
[3] Artaki I.Research Trends in Lead-free Soldering in the US:NCMS Lead-Free Solder Project, Environmentally Conscious Design and Inverse Manufacturing[A].,1999:602.
[4] IverEAnderson.Tin-Silver-Copper: A Lead-Free Solder for Capacitor Interconnects[M].Proc 16th Capacitor and Resistor Technology Symposium,1996:16.
[5] Garner C M;Gupta V.Challenges in converting to lead-free electronics[A].,2000
[6] Mulugeta Abtew;Guna Selvaduray.Lead-free Solders in Microelectronics Materials Science and Engineering[J].,2000(27):95.
[7] Suk Chae Kang;Daniel F Baldwin.Prediction of Solder Interconnects Wetting and Experimental Evaluation[A].,2002:1645.
[8] 朱传征;许海涵.物理化学[M].北京:科学出版社,2000
[9] SukChaeKang;Daniel F Baldwin.Development of solder interconnects wetting model[M].IEEE 8th International Symposium on Advanced Packaging Materials,2002:47.
[10] Katsuaki Suganuma .Advances in lead-free electronics soldering[J].Current opinion in solid state & materials science,2001(1):55-64.
[11] 田民波.电子封装工程[M].北京:清华大学出版社,2003
[12] Tu KN.;Zeng K. .Tin-lead (SnPb) solder reaction in flip chip technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2001(1):1-58.
[13] WangL;Yu D Q;Zhao J .Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy[J].Materials Letters,2002,56:1039.
[14] Soon-Min Hong;Jae-Yong Park;Choon-Sik Kang;Jae-Pil Jung .Fluxless wetting properties of UBM-coated Si-Wafer to Sn-3.5wt%Ag solder[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2003(1):255-261.
[15] 吴念祖 .焊接技术基础讲座[OL].http://www.chinaemnet:com/big5/smt/smt043441:asp
[16] Ogata S;Kanai M;Takei T.Wetting balance evaluation by SP tension method for Pb free solder paste[A].,1998:386.
[17] Sattiraju S V;Dang B;Johnson R W.Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes[A].,2001:45.
[18] Chung C Key;Faizul Mustapha;Fay Hua.An assessment of lead free solder Sn3. 7Ag0. 8Cu Wettability[A].,2002:1.
[19] 龚代涛,刘晓波,王国勇.Sn-Zn-Ag系无铅钎料焊接性能研究[J].电子工艺技术,2003(03):96-99.
[20] Carlos Drummond;Jacob Israelachvili .Surface forces and wettability[J].Journal of Petroleum Science & Engineering,2002(1/3):123-133.
[21] 安兵 .多层膜界面能测量及其结构稳定性研究[D].华中科技大学,2003.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%