通过异氟尔酮二异氰酸酯( IPDI )与聚乙二醇( PEG )反应得到含有异氰酸根( NCO )的加成物(PEG-IPDI),PEG-IPDI再与甲基丙烯酸羟乙酯(HEMA)发生反应得到端乙烯基聚氨酯丙烯酸酯预聚体( PEG-IPDI-HEMA)。将PEG-IPDI-HEMA与活性稀释剂组成有机粘结相,片状银粉为导电相,制备了紫外光( UV)固化聚氨酯基导电银浆。采用傅里叶变换红外光谱( FTIR)对预聚体PEG-IPDI-HEMA进行了表征,研究了PEG分子量、活性稀释剂种类及其用量对银浆的电导率、附着力和耐弯折性能的影响。结果表明：当PEG分子量为400g/mol,采用质量分数17．0%的1,6-己二醇二丙烯酸酯( HDDA)作为活性稀释剂,可制备综合性能优良的导电银浆。银浆电导率达到1．88×105S/m；银浆与聚对苯二甲酸乙二醇酯(PET)基材具有良好的附着力,百格测试级别达到5 B；耐弯折性能优异,在10次弯折测试后,电导率仍能达到7．41×104S/m。
Adduct containing isocyanate group ( PEG-IPDI ) was first synthesized by a nucleophilic addition be-tween isophorone diisocyanate( IPDI) and polyethylene glycol( PEG). Then polyurethane-acrylate prepolymer termi-nated with vinyl(PEG-IPDI-HEMA)was synthesized by PEG-IPDI reacting with hydroxy ethyl methacrylate(HE-MA). After that,UV curable polyurethane-based conductive silver paste was prepared by using PEG-IPDI-HEMA and reactive diluent as adhesive phase,flake silver as conductive phase. PEG-IPDI-HEMA was characterized by Fourier transform infrared spectroscopy( FT-IR). Effects of molecular weight of PEG,types and content of reac-tive diluent on the conductivity,adhesion and bending resistance of the conductive silver paste were investigated. The results showed that when the molecular weight of PEG was 400g/mol,1,6-hexanediol diacrylate(HDDA)was used as reactive diluent and its content was 17. 0wt%,the silver paste with execllent performance was obtained. The conductivity of silver paste reached 1. 88 × 105 S/m. Meanwhile,the cured paste had a high adhesion to polyethylene terephthalate( PET) and the level of cross-hatch test reached 5 B. Moreover, the cured paste ex-hibited an excellent bending resistance,whose conductivity was still as high as 7. 41 × 104 S/m after 10 times bending test.
参考文献
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%