介绍了一种用于测量薄膜样品和高压样品比热的一种芯片式量热计,该器件由美国加州大学伯克利分校的Frances Hellman研究组于15年前最先开发研制并投入使用,但其应用在中国尚未见报道.希望此文能为国内相关领域的研究人员起到抛砖引玉的作用.
参考文献
[1] | Denlinger D W;Abarra E N;Kimberly Allen et al.Thin Film Microcalorimeter for Heat Capacity Measurements from 1.5 to 800 K[J].Review of Scientific Instruments,1994,65(04):946. |
[2] | Revaz B;Zink BL;Hellman F .Si-N membrane-based microcalorimetry: Heat capacity and thermal conductivity of thin films[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2005(2):158-168. |
[3] | Navrotsky A;Dorogova M;Hellman F;Cooke DW;Zink BL;Lesher CE;Boerio-Goates J;Woodfield BF;Lang B .Application of calorimetry on a chip to high-pressure materials.[J].Proceedings of the National Academy of Sciences of the United States of America,2007(22):9187-9191. |
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