采用真空热压烧结工艺在580 cc下制备了35％(体积分数)SiCp/2024铝基复合材料,利用扫描电镜(SEM)、透射电镜(TEM)、能谱(EDS)、高分辨透射电镜(HRTEM)对复合材料热处理过程中微观组织进行了表征,研究了热压烧结后复合材料的析出相的微观结构以及析出相在热处理过程的演变规律.结果表明,热压烧结后复合材料中存在许多粗大析出相颗粒,包括Al4Cu9,Al2Cu,Al18Mg3Mn2,Al5Cu6Mg2和Al7Cu2Fe.随着固溶温度的提高,粗大析出相颗粒逐渐回溶到Al基体中,当固溶温度达到510℃时,粗大析出相颗粒几乎全部回溶到基体中,但还存在少量的难溶相.复合材料经510℃固溶2 h+190℃时效9h后,除了少量的难溶相,许多圆盘状纳米析出相Al2Cu和棒针状纳米析出相Al2CuMg弥散分布于基体中且与基体的界面为错配度较小的半共格界面,圆盘状纳米析出相的直径为50～200 nm,棒针状纳米析出相长度为100 ～ 150 nm.
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