以双酚A型环氧树脂EP638、EP828为基体树脂，丁腈橡胶为增韧剂，酰肼为固化剂，咪唑为固化促进剂，引入导热填料氮化硼、氧化铝，制备了高耐热高耐焊性环氧胶膜。采用单因素试验法优选出制备环氧胶膜的最佳工艺条件，对环氧胶膜的导热性能、介电性能、剪切强度、粘结强度和玻璃化转变温度（Tg）等进行测试。结果表明：制备高耐热高耐焊性环氧胶膜的最佳工艺条件是：m(EP638)∶m(EP828)=1∶1；w(丁腈橡胶)=20%，w(酰肼)=10%，w(咪唑)=5‰，w(填料)=60%，m(A12O3)∶m(BN)=1∶1；固化条件为120℃/1 h+150℃/1 h。此时环氧胶膜的介电常数为5.66，导热系数为0.581 W/(m·K)，粘结强度为36.99 MPa，Tg为174.77℃，耐浸焊时间达10 min。
We prepared a high heat resistance and solder resistance epoxy adhesive film using bisphenol A type epoxy resin EP638 and EP828 as matrix resin, nitrile rubber as toughening agent, hydrazide as curing agent, imidazole as curing catalyst, and adding thermal conductive fillers boron nitride and alumi-na. The optimum process condition to prepare the epoxy adhesive film was optimized by single factor experiment method, and its thermal conductivity, dielectric property, shear strength, bonding strength and glass transition temperature(Tg) were tested. The results show that the optimum process condition is that the mass ratio between EP638 and EP828 is 1∶1, the mass fraction of nitrile rubber is 20%, the mass fraction of hydrazide is 10%, the mass fraction of imidazole is 5‰, the mass fraction of fillers is 60%, the mass ratio between A12O3 and BN is 1∶1, and the curing condition is“120 ℃/1 h+150 ℃/1 h”. While, the dielectric constant of the epoxy adhasive film is 5.66, the thermal conductivity is 0.581 W/(m· K), the bonding strength is 36.99 MPa, the Tg is 174.77℃, and the solder resistance time is 10 min.
参考文献
| [1] | 王隽,顾嫒娟,梁国正,王江华,陈诚,李春艳.典型环氧树脂覆铜板耐湿热性能的研究[J].绝缘材料,2012(06):43-45,50. |
| [2] | 雷佑安.耐高温环氧胶固化工艺研究[J].河北化工,2012(05):49-50. |
| [3] | 李桢林,辛丽丽,危伟,范和平.一种新型挠性覆铜板用环氧胶粘剂的研究[J].绝缘材料,2007(02):26-27. |
| [4] | 孔凡旺,苏民社,杨中强.金属基板用高导热胶膜的研制[J].绝缘材料,2011(02):17-20. |
| [5] | 任文娥,周文英,于钦学,徐阳.HTPB液体橡胶改性环氧树脂的研究[J].绝缘材料,2012(06):30-33. |
| [6] | 邵康宸,李会录,韩江凌,田红娟,杨柳.单组分导热性耐焊型环氧树脂胶粘剂的研制[J].中国胶粘剂,2013(09):28-31. |
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