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对近年来国内外纳米多层膜的研究文献进行了综述,介绍了纳米多层膜的电沉积制备、性能及应用,总结归纳了近年来人们对研究纳米多层膜所做出的工作,分析了纳米多层膜的发展趋势.

参考文献

[1] Wang L.;Yuzhang K.;Troyon M.;Bonhomme P.;Douglade J. Metrot A.;Fricoteaux P. .GROWTH MECHANISM AND STRUCTURE OF ELECTRODEPOSITED CU/NI MULTILAYERS[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1995(1/2):160-167.
[2] 游阳明.电沉积制备纳米迭层薄膜材料[J].电镀与精饰,1995(04):20.
[3] Oberle R R;Cammarata R C .Dependence of hardness on modulation amplitude in electrodeposited Cu/Ni compositionally modulated thin films[J].Scripta Metallurgica et Materialia,1995,32(04):583.
[4] Tench T;White M.Enbanced tensile strength for electrodeposited nickel-copper multilayer composites[J].Metallurgical and Materials Transactions,1984(15):2093.
[5] Gomez E.;Labarta A.;Llorente A.;Valles E. .Characterisation of cobalt/copper multilayers obtained by electrodeposition[J].Surface & Coatings Technology,2002(2/3):261-266.
[6] Panagopoulos C.N.;Papachristos V.D. .Ni-P-W MULTILAYERED ALLOY COATINGS PRODUCED BY PULSE PLATING[J].Scripta materialia,2000(7):677-683.
[7] Zhang W.;Xue QJ. .TRIBOLOGICAL PROPERTIES OF NICKEL-COPPER MULTILAYER FILM ON BERYLLIUM BRONZE SUBSTRATE[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1997(1/2):292-296.
[8] Takeshi M;Michi Y K.Electro-deposotion of Cu/Ni-P multilayers by a single bath technique[J].Thin Solid Films,2001(397):83.
[9] 薛江云.电沉积铜钴纳米多层膜的机理研究[J].电化学,1997(04):401.
[10] 薛江云.电沉积铜镍纳米多层膜的机理[J].北京科技大学学报,1996(10):46.
[11] Troyon M;Wang L.Influence of saccharin on the structure and corrosion resistance of electrodeposited Cu/Ni multilayers[J].Applied Surface Science,1996(103):517.
[12] 顾卓明,黄婉娟,王仁兵.多层复合镀层工艺与性能的研究[J].机械工程材料,2002(10):26-29.
[13] 喻敬贤;陈永言;黄清安 等.电化学制备Ni-Cu/Cu超晶格多层膜[J].武汉大学学报(自然科学版),1998,12(06):32.
[14] Bader S D;Moog E R;Grünberg P .Magnetic hysteresis of epitaxially-deposited iron in the monolayer range:a Kerr effect experiment in surface magnetism[J].Journal of Magnetism and Magnetic Materials,1986,53(04):295.
[15] Lassri H;Ouahmane H;Fanity E.Ferromagnetic resonance studies of electrodeposited Ni/Cu multilayers[J].Thin Solid Films,2001(389):245.
[16] 许俊华,顾明元,李戈扬.纳米多层膜力学性能研究进展[J].宇航材料工艺,1999(03):7-11.
[17] Yamada A.;Houga T.;Ueda Y. .Magnetism and magnetoresistance of Co/Cu multilayer films produced by pulse control electrodeposition method[J].Journal of Magnetism and Magnetic Materials,2002(1/3):272-275.
[18] Kazeminezhad I;Schwarzacher W.Magnetic properties of alloy films prepared by fast pulse-plating[J].Journal of Magnetism and Magnetic Materials,2001(226):1650.
[19] Budur A;Moisa I.On the magnetic sensors using multiplayer thin cylindrical films investigation[J].Sensors and Actuators A-Physical,1997(59):153.
[20] Zhang W;Xue Q J.Fretting wear characteristics of Ni/Cu multilayers electrodeposited on beryllium bronze substrate[J].Wear,1998(214):23.
[21] Ogden C.Electrodeposition of thin films and multilayer on silicon[J].Plating and Surface Finishing,1986(05):130.
[22] Ebrahimi F;Kong D .Effect of microstructure on strength and fracture of electro-deposited Cu/Ni layered nano-composites[J].Scripta Materialia,1999,40(05):609.
[23] Sayan A.Use of nanoscaled multiplayer and compound films to realize a soft lubrication phase within a hard,wear-resistant matrix[J].Surface and Coatings Technology,2001(126):159.
[24] 黄婉娟 .耐磨复合镀层工艺及其性能研究[D].上海海运学院,2001.
[25] Logothetidis S;Petalas J;Flevaris N K et al.Optical studies of Cu-Ni,Pd-Ni and Co-Pt multilayers by conventional and synchrotron radiation ellipsometry[J].Thin Solid Films,1993,234(02):538.
[26] Bakonyi I;Toth J;Kiss L F.Origin of giant magnetoresistance contributions in electrodeposited Ni-Cu/Cu multilayers[J].Journal of Magnetism and Magnetic Materials,2004(269):156.
[27] 王为,郭鹤桐.纳米复合镀技术[J].化学通报,2003(03):178-183.
[28] 王万平 .多层膜巨磁电阻材料及应用研究[D].电子科技大学,2000.
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