综述了一种新的制备聚酰亚胺(PI)薄膜的方法--气相沉积聚合(VDP)的研究进展,用此方法制得的聚合物膜具有纯度高、膜厚可控、可实现保形涂敷、可制备难溶难熔聚合物、集聚合与成膜为一体等优点.讨论了单体种类、气化温度、真空度、沉积基质、沉积时间和酰亚胺化的温度、压力、时间等对PI的VDP过程的影响,展望了VDP法制得的PI薄膜的主要应用领域.
参考文献
| [1] | 银苗根;姚寿山;张少宗.现代表面技术[M].北京:机械工业出版社,1999:242-243. |
| [2] | Gorham W F .[P].U.S.Pat3342754,1967. |
| [3] | Tkachuk B V;Bushin V V;Kolotyrkin V M et al.[J].U S S R Polym Sci,1967,9(09):2281-2289. |
| [4] | Iijima M;Ukishima S;Takahashi Y et al.[J].Polymer Science and Technology,1996,53(05):317-321. |
| [5] | Li A K;Janarthanan N;Hsu C S .[J].Polymer Bulletin,2000,45:129-135. |
| [6] | Jou J H;Chenc C L .[J].Journal of Polymer Science Part B:Polymer Physics,1996,34:2239-2246. |
| [7] | Salem J R;Sequeda O;Duran J et al.[J].Journal of Vacuum Science and Technology A-Vacuum Surfaces and Films,1986,4(03):369-374. |
| [8] | Iijima M;Takahashi Y;Inagawa K et al.[J].Journal of Vacuum Society of Japan,1985,28:437. |
| [9] | B?te M;Neuber C;Giesa R et al.[J].Macromolecular Rapid Communications,2004,25:371-376. |
| [10] | Kowlczyk S P;Dimitrakopoulos C D;Molis S E .[J].Materials Research Society Symposium Proceedings,1991,227:55. |
| [11] | Pethe R G;Carlin C M;Patterson H H et al.[J].Materials Research,1993,8:3218. |
| [12] | Lee BJ.;Kim HG.;Lee DC. .Electrical properties of polyimide thin films formed by the vapor deposition polymerization method[J].Surface & Coatings Technology,2002(2/3):182-187. |
| [13] | Yanagisita H.;Haraya K.;Nakane T.;Tsuchiya T.;Koura N.;Kitamoto D. .PREPARATION AND PERVAPORATION PERFORMANCE OF POLYIMIDE COMPOSITE MEMBRANE BY VAPOR DEPOSITION AND POLYMERIZATION (VDP)[J].Journal of Membrane Science,1997(1/2):121-126. |
| [14] | Tsai F Y .Engineering Vapor-Deposited Polyimides[D].The University of Rochester,2002. |
| [15] | Hsu S C;Whang W T;Chen S C .[J].Journal of Polymer Research,2003,10:7-12. |
| [16] | Grunze M;Lamb R N .[J].Chemical Physics Letters,1987,133(04):283. |
| [17] | Tsai F Y;Harding D R;Chen S H et al.[J].Polymer,2003,44:995-1001. |
| [18] | Jang J;Lim B .[J].Angewandte Chemie International Edition,2003,42:5600-5603. |
| [19] | Maggioni G;Caruran S;Boscarino D et al.[J].Materials Letters,1997,32:147-150. |
| [20] | Ukishima S.;Sato M.;Takahashi Y.;Fukada E.;Iijima M. .HEAT RESISTANT POLYIMIDE FILMS WITH LOW DIELECTRIC CONSTANT BY VAPOR DEPOSITION POLYMERIZATION[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1997(0):475-479. |
| [21] | Miyamae T;Tsukagoshi K;Matsuoka O et al.[J].Japanese Journal of Applied Physics,2002,41:746-748. |
| [22] | Itoh E;Miyairi K.Proc. Int. Symp. Electr. Insul[C].Mater,Tokyo:IEEE,2001:71-74. |
| [23] | Kim Y;Cho W J;Ha C S et al.[J].Cryst Liq Cryst,1996,280:343. |
| [24] | Lee J G;Kim Y;Jang S H et al.[J].Applied Physics Letters,1998,72:1757. |
| [25] | Kim Y;Lee J G;Han K et al.[J].Thin Solid Films,2000,363:264. |
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