目的：研究一种复合清洗剂对铜膜表面腐蚀缺陷的控制效果。方法通过单因素实验优化无磨料复合清洗剂组成和相应的清洗工艺,并通过研究优化的清洗条件对不同类型铜晶圆表面划伤、残留颗粒的清洗效果,验证该清洗剂的清洗性能。结果优化的清洗剂组分和清洗工艺为：金属离子螯合剂体积分数0.025%,表面活性剂体积分数0.1%；清洗剂温度30℃,清洗剂流量3 L/ min。优化的复合清洗剂能大幅度降低铜膜表面划伤和表面粗糙度,对铜膜表面残留的颗粒有较强的去除作用。结论优化的复合清洗剂能够对不同类型铜晶圆表面缺陷进行大幅度的修正,研究成果对提高大规模生产中晶圆的成品率有一定的指导作用。
Objective To study the controlling effect of a composite cleaning agent on the surface corrosion defects of copper film. Methods Through the single factor experiment, the composition ratio and corresponding cleaning process of the abrasive free composite cleaning agent were optimized. According to the cleaning effect of the scratches and the residual particles on the copper film surface, the cleaning effect of the cleaning agent mentioned above was verified. Results It was confirmed that the copper film achieved the lowest corrosion rate and surface roughness when the volume fraction of metal ion chelating agent was 0. 025% , the surfactant concentration was 0. 1% , the cleaning agent temperature was 30 ℃ , and the cleaning agent flow rate was 3 L/ min. The cleaning agent could reduce the values of the scratches and the surface roughness of the copper films, it also showed strong inhibito-ry effect on the residual particle number of the copper films. Conclusion The optimized composite cleaning agent showed significant modification effects for different types of copper wafer surface defects, which can play a guiding role in improvement of the wafer yield in mass production.
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