铝诱导晶化法(AIC)是一种低温制备大晶粒多晶硅薄膜的重要方法.本文分别基于Al/Al2O3/a-Si叠层和a-Si/SiOx/Al叠层制备了AIC多晶硅薄膜,前者表面粗糙,后者表面光滑.以后者为籽晶层,在其上用HWCVD法300℃低温下外延生长了表面形貌与籽晶层相似的多晶硅薄膜.铝诱导晶化过程中,在原始非晶硅层中会形成多晶硅、非晶硅和铝的混合层,去除铝后残留的硅将使表面粗糙,而在原始铝层中则形成连续的多晶硅薄膜.Al/Al2O3/a-Si 叠层和a-Si/SiOx/Al叠层的上层分别是非晶硅层和铝层,发生层交换后,前者上层是硅铝混合层,因此表面粗糙,后者上层是连续的多晶硅薄膜,因此表面光滑.在AIC多晶硅薄膜表面外延生长多晶硅薄膜等效于铝诱导多晶硅的晶核在垂直于薄膜方向上的继续生长,因此外延生长的薄膜与AIC多晶硅薄膜呈现相似的枝晶状形貌.
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