利用电化学交流阻抗谱(EIS)分析和研究了硫酸盐还原菌(SRB)在银、金、玻碳、Q235碳钢和高钼双相不锈钢电极表面的粘附动力学过程.基于EIS检测数据并通过公式推导提出了评估硫酸盐还原菌(SRB)附着过程的双电层电容变化模型.另外石英晶体微天平(QCM)和扫描电子显微镜(SEM)也被用来表征细菌粘附的动力学过程.
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