采用热丝化学气相沉积(HFCVD)系统,以CH4和H2为反应气体,在多晶氧化铍陶瓷基体上沉积了金刚石薄膜.采用场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)和激光热物性测试仪进行检测分析,研究工艺参数对金刚石薄膜生长及膜/基复合体热学性能的影响.结果表明:随着CH4浓度的增加(或CH4浓度一定,反应气体总流量增加),金刚石晶粒尺寸逐渐减小,膜/基复合体的热导率逐渐降低;当CH4浓度为2%(体积分数),流量为30 cm3/min,压强为1.33 kPa时,沉积的膜/基复合体的热导率最高,可达2.663 W/(cm·K).
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