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采用40μm球形与无规则形α—Al2O3粒子填充液体硅橡胶,研究了Al2O3粒子用量、形貌对液态灌封胶的粘度与热导率的影响,并用XRD、SEM分析了两种Al2O3的晶型以及在灌封胶中的分布状态。结果表明,在相同的填充量下无规则形Al2O3粒子填充灌封胶的热导率高,球形Al2O3填充灌封胶的可加工性优异。当球形与无规则形填料混合填充的比例为9:1时可以获得最高的热导率,比单一使用球形Al2O3提高了17.1%。

The α-Al2O3 particles with sphericity and irregularity were filled in liquid silicone rubber of which the size is 40μm. The effect of Al2O3 particles amount and morphology on the viscosity and thermal conductivity of liquid encapsulants was studied, meanwhile the crystal form and distribution in the encapsulants of two kinds of alumina was observed by XRD and SEM. The results indicated that the thermal conductivity of liquid encapsu- lants filled with irregular particles was much higher, while the processing performance was rather excellent for sphericity. The thermal conductivity was highest as the ratio of sphericity and irregularity reached 9 : 1, which increaed by 17.1% compared with the case of only sphericial particles.

参考文献

[1] Kinjo N;Ogata M;Nishi K.Epoxy molding compounds as encapsulation materials for microelectronic devices[J].Advances in Polymer Science,1989(88):1-48.
[2] Lewis T;Nielsen L .Dynamic mechanic properties of partieulate-filled composites[J].Journal of Applied Polymer Science,1970,14:1449-1451.
[3] 汪雨迪;周和平 .AIN/聚乙烯复合基板的导热性能[J].无机材料学报,2000,15(06):1030-1036.
[4] Wong C.P.;Bollampally R.S. .Comparative study of thermally conductive fillers for use in liquidencapsulants for electronic packaging[J].IEEE transactions on advanced packaging,1999(1):54-59.
[5] Woo J .A low-viscousity,high thermally conductive epoxy molding compound(EMC)[J].Macromolecular Research,2004,12(01):78-84.
[6] Agari Y;Ueda A et al.Thermal conductivity of a poly-ethylene filled with disoriented short-cut carbon fibers[J].Journal of Applied Polymer Science,1991,4,3(06):1117-1124.
[7] Agari Y;Ueda A et al.Thermal conductivity of composites in several types of dispersion systems[J].J Appl Palym Sci,1991,42(06):1665-1669.
[8] C.-G. Wu;Y.-C. Liu .Assembly of conducting polymer/metal oxide multilayer in one step[J].Synthetic Metals,1999(1/3):1268-1269.
[9] PDF Card No,83-2080[M].
[10] Shimazaki Y .Preparation and characterization of thermoconductive polymer nanocomposite with branched alu-mina nanofiber[J].Applied Physics Letters,2008,92:133309.
[11] Richard C;Farrar D .Polymer adhesives and encapsu-lants for microelectronie applications[J].Johns Hopkins Apl Technical Digest,2008,28(01):58-71.
[12] 刘伯谦.逾渗理论应用导论[M].北京:科学出版社,1997:86-98.
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