环氧树脂封装材料由于存在诸多不足,长期以来仅限于小功率LED的封装,而大功率LED的封装只能依赖国外进口的有机硅封装材料.通过高折射率无机氧化物的改性作用而制备的纳米改性有机硅封装材料是近年发展的一类新型大功率LED封装材料,但其粒子的分散性、与基体的相容性以及封装后的稳定性等仍然是国内众多研究人员需要继续研究和探讨的关键问题.
Epoxy resin encapsulant is limited in low-power LED due to its several shortcomings,while imported organic silicon is generally accepted as postential material for high-power LED encapsulant. The nanocomposite organic silicon that is modified by high refractive inorganic nanoparticles has been proved to be a suitable choice. However,the dispersion,thee compatibility and its stabilization as a new type of high-power LED encapsulant are critical problems for researchers at home and abroad.
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