Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340{400°C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360°C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn /Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
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| [1] | |
| [2] | |
| [3] | |
| [4] | J.W. Jang, P.G. Kim, K.N. Tu and M. Lee: J. Mater.Res., 1999, 14(10), 3895.[2]M.M. El-Bahay, M.E. El Mossalamy, M. Mahdy and A.A. Bahgat: Phys. Status Solidi A, 2003, 198(1), 76.[3]K.L. Murty, M.D. Mathew and F.M. Haggag: Met. Mater. Int., 1998, 4, 799.[4]R.K. Mahidhara, S.M.L. Sastry, K.L. Jerina, I.Turlik and K.L. Murty: J. Mater. Sci. Lett., 1994, 13(19), 1387.[5]M.H.N. Beshai, S.K. Habib, A.M. Yassein, G. Saad and M.M.H. El-Naby: Cryst. Res. Technol., 1999, 34(1), 119.[6]A. Yassin, R.L. Reuben, G. Saad, M.H.N. Beshai and S.K. Habib: Proc. IME J. Mater. Des. Appl., 1999, 213(L1), 59.[7]K.L. Murty, F.M. Haggag and R.K. Mahidhara: J. Electron. Mater., 1997, 26(7), 839.[8]A.R. Geranmayeh and R. Mahmudi: J. Electron. Mater., 2005, 34(7), 1002.[9]R.K. Mahidhara, S.M.L. Sastry, I. Turlik and K.L. Murty: Scripta Mater., 1994, 31(9), 1145.[10]M.D. Mathew, H. Yang, S. Movva and K.L. Murty: Metall. Mater. Trans. A, 2005, 36(1), 99.[11]A.A. El-Daly, Y. Swilem and A.E. Hammad: J. Alloy. Compd., 2009, 471(1-2), 98.[12]S.W. Chen, C.C. Chen, W. Gierlotka, A.R. Zi, P.Y. Chen and H.J. Wu: J. Electron. Mater., 2008, 37(7), 992.[13]Q.L. Zeng, X.L. Gu, X.B. Zhao, C.Z. Chen and X.G. Liu: Electron. Compon. Mater., 2008, 27(8), 16. (in Chinese)[14]C. Lee, C.Y. Lin and Y.W. Yen: Intermetallics, 2007, 15(8), 1027.[15]P. Villars, A. Prince and H. Okamoto: Handbook of Ternary Alloy Phase Diagrams, 2nd edn, ASM International, The Materials Information Society, 1997, 10005.[16]E.P. Lopez, P.T. Vianco and J.A. Rejent: J. Electron. Mater., 2005, 34(3), 299.[17]P.T. Vianco and J.A. Rejent: J. Electron. Mater., 1999, 28(10), 1138.[18]J.J. Guo, A.P. Xian and J.K. Shang: Surf. Coat. Technol., 2007, 202(2), 268.[19]Q.L. Zeng, J.J. Guo, X.L. Gu, X.B. Zhao and X.G. Liu: Liquid-State Interfacial Reaction of Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate,[20] : in Int. Conf. on Electronic Packaging Technology & |
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