电子封装焊点的热循环失效是焊点材料损伤逐步发展的结果,本工作旨在对SnAgCu钎料的热循环损伤失效行为进行研究.以连续损伤力学理论为基础,提出了一种适用于热循环条件下SnAgCu钎料蠕变-疲劳交互作用的损伤模型.据此,设计了热力循环实验和热循环实验用以标定损伤模型相关参量.自行设计了双金属剪切加载装置并结合温度循环实验,对SnAgCu钎料的热力耦合损伤行为进行了深入研究.以电阻变化率作为损伤变量,并在热循环的不同周次测量试样的损伤值从而验证损伤模型.结果表明:所提出的幂函数形式的损伤模型能较好的描述SnAgCu钎料的热循环损伤演变.最后,对热循环条件下SnAgCu钎料试样的微观组织演变进行了SEM分析,从而揭示其损伤演变机理.
参考文献
| [1] | Liu X W;Plumbridge W J .[J].Journal of Electronic Materials,2007,36(09):1111. |
| [2] | John W E.A Guide to Lead-free Solders:Physical Metallurgy andReliability[M].London:Springer-Verlag,2007:17. |
| [3] | Choi S;Subramanian K N;Lucas J P et al.[J].Journal of Electronic Materials,2000,29(10):1249. |
| [4] | Basaran C;Tang H;Nie S .[J].Mechanics of Materials,2004,36(11):1111. |
| [5] | Liu X W;Plumbridge W J .[J].Materials Science and Engineering A,2003,362(1-2):309. |
| [6] | Chandrakanth S;Pandey P C .[J].Engineering Fracture Mechanics,1995,50(04):457. |
| [7] | Lemaitre J .[J].Nuclear Engineering and Design,1984,80(02):233. |
| [8] | Chaboche J L .[J].ASTMSpecial Technical Publication,1982,770:81. |
| [9] | Lemaitre J;Plumtree A .[J].ASME Journal of Engineering Materials and Technology,1979,101(03):284. |
| [10] | Fan Z C;Chen X D;Chen L et al.[J].International Journal of Pressure Vessels and Piping,2009,86(09):628. |
| [11] | Liu N;Li X Y;Yan Y C.[A].Piscataway(NJ):IEEE,2008 |
| [12] | Yang Q D;Shim D J;Spearing S M .[J].Microelectronic Engineering,2004,75(01):85. |
| [13] | Jiang Li;Yang Keling;Zhou Jiemin et al.[J].Microelectronics Reliability,2008,48(03):438. |
| [14] | Darveaux R.[A].Piscataway(NJ):IEEE,2005 |
| [15] | Wiese S;Meusel E .[J].ASME Journal of Electronic Packaging,2003,125(04):531. |
| [16] | Mavoori H .Mechanical Properties and Fatigue Lifetime Prediction of Solders for Electronic Applications:Tin-Silver and Tin-Zinc Eutectics[D].Evanston:Northwestern University,1996. |
| [17] | Subramanian K N;Lee J G .[J].Materials Science and Engineering A,2006,421(1-2):46. |
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