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用实验方法研究了工业纯铁在等径角挤压变形(路径C)过程中晶粒细化过程.实验结果表明,经4道次剪切变形后开始出现纳米级晶粒.晶粒细化过程为:原始粗晶粒→晶粒被剪切变形带分割→位错线分割滑移带→位错线发展为位错墙,把变形带分割成细小的亚晶→亚晶界的位错密度增加→形成大角度晶界的纳米晶粒.测试了不同变形道次下材料的显微硬度值.

参考文献

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