采用模拟印刷电路板缝隙腐蚀装置,发展阵列电极方法测试缝隙内电路板表面铜在NaCl溶液中的腐蚀电位,研究了多种因素对其缝隙腐蚀行为的影响.结果表明,缝隙宽度为20～30μm时,印刷电路板容易发生缝隙腐蚀;在浸泡初期,缝隙内铜的腐蚀电位随浸泡时间延长负移,但浸泡48 h后,变化趋势较小;溶液中NaCl浓度达到1 mol/L时,对促进电路板的缝隙腐蚀作用较为明显;酸性范围内,缝隙内电路板腐蚀电位随缝隙大小、浸泡时间、NaCl溶液浓度、溶液的pH值降低而负移;温度低于45℃后,缝隙内铜的腐蚀电位随温度的升高而降低.
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