铜合金由于具有优良的导电导热性能,已在现代集成电路塑料封装中占据了引线框架材料80%的份额.但铜合金容易氧化,其氧化膜被认为是塑料对装再流焊工艺中的分层和裂纹的主要原因之一,因此引线框架铜合金的氧化特性引起了人们的广泛注意.为获得铜合金引线框架良好的可靠性,不少材料工作者对铜舍金在塑料封装中的氧化特性及其对铜合金与环氧树脂模压料(EMC)的粘接强度的影响进行了研究,为此,本文对引线框架铜合金的氧化物结构及动力学、铜合金与环氧树脂模塑料(EMC)粘接强度的影响因素等领域的研究进行了综述.
参考文献
| [1] | Takano E;Mino T;Takahashi K.The Oxidation Control of Copper Leadframe Package for Prevention of Popcorn Cracking[A].,1997:78-83. |
| [2] | 王碧文 .[J].有色金属,1997,49(03):95-99. |
| [3] | Lahiri SK.;Heng KW.;Ang L.;Goh LC.;Singh NKW. .Kinetics of oxidation of copper alloy leadframes[J].Microelectronics journal,1998(6):335-341. |
| [4] | Aug G L;Gob L C;Herng K W;et al Lahiri,SK.[A].,1995:218-220. |
| [5] | Cho SJ;Paik K W .[J].Scripta Materialia,1998,38(07):1149-1154. |
| [6] | Yoshioka O.Improvement of Moisture Resistance in Plastics Encapsulants MOS-IC by Surface Finishing Copper Lead Frame[C].Proc39thECTC,1989:464-471. |
| [7] | Kim S .Hybrids,and Manufacturing Technology[J].IEEE Transactions,1991,14(04):809-817. |
| [8] | Moon B H;Yoo H Y;Sawada K.Optimal Oxidation Control for Enhancement of Copper lead Frame-EMC Adhesion in Packaging Process[A].,1998:1148. |
| [9] | Soon-Jin Cho;Kyung-Wook Paik;Young-Gil Kim .The effect of the oxidation of Cu-base leadframe on the interfaceadhesion between Cu metal and epoxy molding compound[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1997(2):167-175. |
| [10] | Tosbikazu M;Kanako S;Atsushi K.Development of Moisture-Proof thin and Large QFP with Copper Lead Frame[A].,1998:1125-1131. |
| [11] | Yasuo T;Junji M.Oxide Adhesion Characteristic of Lead Frame Copper Alloys.Proceedir gs-Electronic Components and Technology Conference Jun 1-Jun 4 1999 Sponsored by IEEE[C].Electronic Industries Alliance IEEE,1999:714-720. |
| [12] | Ohsuga H;Suzuki H;Aihara T H T.Developmnent of Molding Compounds Suited for Copper Leadframes[A].,1994:141-146. |
| [13] | Kang T G;Park I S;KIM J H.Characterization of Oxidized Copper Lead Frames and Copper/Epoxy Molding Compound Interface Adhesion in Plastic Package,Adhesive Joining and Coating Technology in Electronics Manufacturing,1998[M].,1998 |
| [14] | Choi K S;Kang T G;Park I S et al.[J].IEEE Transactions on Electronics Packaging Manufacturing,2000,23(01):32-38. |
| [15] | Kinloch AK .[J].Journal of Materials Science,1980,15:2111-2166. |
| [16] | YoshiokaO;OkabeN;Nagayama S.Improvement of Mois ture Resistance in Plastic Encapsulants MOS-IC by Surface Finishing Copper Leadframe[A].,1989:464-471. |
| [17] | Arrowsmith DJ .[J].Transactions of the Institute of Metal Finishing,1970,48:88-92. |
| [18] | Asai S I;Ando T;Tobita M .[J].Journal of Adhesion Science and Technology,1996,10:1-15. |
| [19] | LoveBJ;PackmanPF .[J].JOURNAL OF ADHESION,1993,40:139-150. |
| [20] | Ahn S H;Yoon H G;Oh S Y.Reliability Improvement of Plastic Ball Grid Array Package by UV/Ozone Cleaning[C].Proc ISHM,1995:7-12. |
| [21] | Kim S .[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1991,14:809-817. |
| [22] | Slominski L J;Landau A .[J].Plating and Surface Finishing,1982,69:96-99. |
| [23] | Evans J RG;Packham DE .[J].JOURNAL OF ADHESION,1979,10:39-47. |
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