选用平均粒径约为50～100μm的碳化硅颗粒作为基料,以水合联氨为还原剂、氨水为络合剂,利用非均相成核法制备铜包覆碳化硅复合粉体材料,在温度为83℃时得到了分散效果较好的复合粉体,采用XRD、SEM、EDS对复合粉体进行了表征,结果表明,制备的铜微晶粒径为100nm左右,碳化硅颗粒表面的铜包覆层均匀、连续.
The size of SiC particles chosen as base material is about 50～ 100μm, hydrazine hydrate as a reducing agent, ammonia as complexing agent, the SiC particles coated with Cu are prepared by the heterogeneous nucleation method. The composite powders have a well dispersed effect at 83℃. The microstructure and morphology of the composites are investigated by XRD, SEM and EDS. The results show that the size of prepared copper microcrystal is about 100nm,the Cu layer coated on SiC particles is uniform and continuous.
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