无铅化的推广给电子组装行业带来很大挑战,使用保护气氛能够有效地提高焊料的润湿性能,从而提高焊点的质量,并且还能够减少焊料的氧化,扩大焊接的工艺窗口.简单介绍了常用的无铅焊料和可控气氛.主要阐述了保护气氛对无铅回流焊峰值温度、润湿性、焊点强度及无铅波峰焊润湿性和氧化渣的影响.最后指出在保护气氛中添加还原性气体及探索更加经济地使用气氛的途径是未来值得研究的方向.
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