丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响

表面技术 , 2012, 41(4): 7-9.

丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响

邢方方 ^1, , 程延海 ^2, , 张世举 ^3, , 陈衡阳 ^4,

1.中国矿业大学机电工程学院,徐州221116

2.中国矿业大学机电工程学院,徐州221116

3.中国矿业大学机电工程学院,徐州221116

4.中国矿业大学机电工程学院,徐州221116

基金项目: 江苏高校优势学科建设工程资助项目国家自然科学基金资助项目(51006117)

关键词：化学镀 , Ni-W-P镀层 , 镀速 , 表面形貌

The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating

采用配方不同的化学镀液,在低碳钢基材上制备出不同的Ni-W-P三元合金镀层,对镀层沉积速度和表面形貌进行了表征.结果表明:镀液中成分的含量对镀速及镀层表面形貌都具有很大的影响,丁二酸具有十分明显的加速作用,而镀速随着钨酸钠含量的增大而减小,改变丁二酸和钨酸钠的含量可以改变镀层的表面形貌.

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材料期刊网

丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响

The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating

参考文献