采用Ag-CuO为封接材料对连接体SUS430和电池片阳极Ni-YSZ在空气中进行封接,通过对泄露率的测定、扫描电镜、能谱分析等方法对封接的气密性、相容性及热循环性能进行了研究。结果表明Ag-CuO材料可实现对连接体与电池片的有效封接,且当材料中的Cu含量为6%（摩尔分数）时模拟泄露率最低,〈0.001mL/（min.cm）,封接材料在经历10次热循环后的气体泄露率无增大,能谱分析表明在连接体/Ag-CuO材料界面没有发生元素扩散现象。
Ag-CuO sealing material was used to realize the sealing between the SUS430 interconnect and the NiO-YSZ anode in air.Leakage rate were tested,and SEM and EPMA tests were conducted to determine its hermeticity,compatability and thermal cycling stability.Results indicated that Ag-CuO sealing material could realize the seals between the interconnect and the anode effectively,and when the Cu content was 6mol%,the simulating leakage was smallest,and lower than 0.001mL/（min·cm）.After ten times thermal cycling,the leakage rate kept stable.EPMA analyses proved that no element diffusion occured at the interconnect/Ag-CuO interface.
参考文献
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