金刚石因其卓越的物理和化学性能一直蕴涵着巨大的应用潜力,但其极高的硬度和优异的化学稳定性使其难以被加工成型,因此,在作为新型电子功能材料走向实际应用过程中,金刚石的微细加工技术非常关键.对近年来国内外采用等离子体刻蚀技术加工金刚石的基本工艺特点和最新进展进行了较系统的比较和总结,重点分析了功率、气体种类、气体流量、偏压、掺杂类型、离子注入、掩膜等因素对刻蚀过程的影响,以期为工艺参数的进一步优化提供参考.
参考文献
| [1] | 张文华;丁桂甫;王谦.[J].微细加工技术,1998(01):37. |
| [2] | 丁桂甫,曹莹,李新永,蒋振新.CVD金刚石薄膜的微机械加工技术研究进展[J].金刚石与磨料磨具工程,2003(01):6-11. |
| [3] | 姚翔,沈荷生,丁桂甫,朱军,张志明,张寿柏.金刚石薄膜的反应离子刻蚀[J].微细加工技术,2000(03):23-28. |
| [4] | 莘海维,张志明,沈荷生,戴永兵,万永中.压阻式金刚石微压力传感器[J].微细加工技术,2001(01):67-73. |
| [5] | Rafi Kalish .[J].Applied Surface Science,1997,117/118:558. |
| [6] | Deguchi M;Hase N;Kitabatake M.[J].Diamond and Related Materials,1997(06):367. |
| [7] | 周灵平;靳九成;李绍禄.[J].半导体技术,1997(04):1. |
| [8] | 凌行,莘海维,张志明,孙方宏,戴永兵,沈荷生.压阻式金刚石压力微传感器的制作与测试[J].微细加工技术,2003(02):69-75. |
| [9] | Job R;Denisenko A V;Zaitesv A M et al.[J].Thin Solid Films,1996,165:290-291. |
| [10] | 张志明;沈荷生;何贤昶.[J].微细加工技术,1999(04):33. |
| [11] | 张志明;李胜华.[J].微细加工技术,1990(2-3):14. |
| [12] | Ramesham R;Rose M F .[J].Thin Solid Films,1998,320:223. |
| [13] | Davis L.[A].,1998:274. |
| [14] | Pan L S;Kania D R.Electronic properties and applications[M].Boston:Kluwer Academic Publishers,1995 |
| [15] | Ding G;Zhao X;Yu A et al.[J].Proceedings of SPIE,2000,4223:61. |
| [16] | Compbell S A.The acience and engineering of microelectric fabrication[M].London:Oxford University Press,2001 |
| [17] | 丁桂甫,俞爱斌,赵小林,姚翔,沈天慧.CVD金刚石薄膜RIE掩模技术研究[J].微细加工技术,2001(03):74-80. |
| [18] | Dorsch O;Werner M;Obermeier E .[J].Diamond and Related Materials,1995,4:456. |
| [19] | Inoue T;Tachibana H;Kumagai K et al.[J].Journal of Applied Physics,1990,67(12):7329. |
| [20] | Bello I;Fung M K;Zhang WJ et al.[J].Thin Solid Films,2000,368:222. |
| [21] | Werner M;Schlichting V;Obermeier E .[J].Diamond and Related Materials,1992,1:277. |
| [22] | Shikata S;Nishibayashi Y;Tomikawa T.[A].MIU,Tokyo,1993:337. |
| [23] | Tessmer G J;Stoner BR.[A].Pennington,NJ,1993:640. |
| [24] | Grot S A;Ditizio R A;Gildenblat G S et al.[J].Applied Physics Letters,1992,61(19):2326. |
| [25] | Jin S;Chen L H;Graebner J E et al.[J].Applied Physics Letters,1993,63(05):622. |
| [26] | Stoner B R;Tessmer G J;Dreifus D L .[J].Applied Physics Letters,1993,62(15):1803. |
| [27] | Ageev V P;Armeyev V Y;Chapliev N I et al.[J].Materials and Manufacturing Processes,1993,8(01):1. |
| [28] | Ral'chenko V G;Korotushenko K G.[J].Diamond and Related Materials,1995(04):893. |
| [29] | Efremow N N;Geis M W;Flanders D C et al.[J].Journal of Vacuum Science and Technology,1985,3(01):416. |
| [30] | Sandhu G S;Chu W K .[J].Applied Physics Letters,1989,55(05):31. |
| [31] | Ando Y;Nishibashi Y;Kobashi K et al.[J].Diamond and Related Materials,2002,11:824. |
| [32] | Otterbach R;Hilleringmann U.[J].Diamond and Related Materials,2002(11):841. |
| [33] | Leech P W;Reeves G K;Holland A S.[J].Diamond and Related Materials,2002(11):833. |
| [34] | Bernard M;Deneuville A;Lagarde T.[J].Diamond and Related Materials,2002(11):828. |
| [35] | Leech P W;Reeves G K;Holland A S.[J].Diamond and Related Materials,2002(11):837. |
| [36] | Ding G F;Yao J Y;Yu A B et al.[J].Proceedings of SPIE,2000,4174:451. |
| [37] | Akihisa Yoshida;Masahiro Deguchi et al.[J].Nuclear Instruments and Methods in Physics Research B:Beam Interaction with Materials and Atoms,1996,112:248. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%