采用改良座滴法在真空条件下研究Au-30％Si(摩尔分数)合金与石墨在1373～1473K温度范围内的润湿性及铺展动力学.结果表明:随着温度升高,该体系润湿性得到改善,T=1373 K时,体系终态接触角高达100°,呈不润湿;当T≥1393K时,随着温度的升高,接触角的变化速率明显加快,接触角减小至16°,呈现良好的润湿性.界面反应产物SiC的形成使得固/液界面能不断降低,为润湿铺展提供驱动力.通过建立新的反应润湿动力学模型,从能量角度阐述润湿铺展机制,预测体系固/液界面能随反应时间的延长呈指数关系降低.在反应控制阶段,理论计算与实验结果一致.
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