采用丝网印刷工艺制备了CuO/BaCo0.02ⅡCo0.04ⅢBi0.94O3共掺Ba0.5Bi0.5Fe0.9Sn0.1O3热敏厚膜,并借助X射线衍射仪、扫描电子显微镜及交流阻抗谱对厚膜的物相、形貌和电学性能进行表征分析.CuO的存在使得厚膜中的BaCo0.02ⅡCo0.94ⅢBi0.94O3出现分解行为和非钙钛矿Ba-Bi氧化物的形成,厚膜主要由大量的颗粒链组成,单个颗粒链主要由Ba0.5Bi0.5Fe0.9Sn0.1O3构成的小晶粒和低熔点的BaCo0.02ⅡCo0.04ⅢBi0.94O3大晶粒组成.当厚膜中CuO含量添加至10％时,可获得最低的室温电阻率;300 h 150℃下,CuO含量为4％的厚膜老化率约为2.3％.厚膜的电学性能主要来自于晶界的贡献,较低温区内晶界表现为氧空位电导,较高温区下为电子与氧空位耦合电导.
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