分别采用溅射和蒸发镀膜法在Hg1-xMnxTe试样表面形成了Au/Hg1-xMnxTe和Al/Hg1-xMnxTe接触,并用Aligent4155c I-V测试仪对其I-V特性进行了测量,随后对试样在10%NH4F:10%H2O2:H2O中进行了钝化处理,并对处理后的试样再次进行了I-V测量,对于测试结果用热电子发射-扩散理论进行了分析.结果表明:Au与Hg1-xMnxTe形成了良好的欧姆接触,而Al与Hg1-xMnxTe形成了具有整流特性的肖特基接触,其肖特基势垒的理论推算值为0.38eV.钝化处理后的试样,其表面漏电现象明显降低,Au/Hg1-xMnxTe接触的电流下降幅度在0.1V时最大,为76.1%;而Al/Hg1-xMnxTe接触在0.2V时最大,为93.2%.随着偏压的进一步增大,两种接触的电流减小的幅度都逐渐变小.
参考文献
[1] | Furdyna J K .[J].Journal of Vacuum Science and Technology,1982,21(01):220-228. |
[2] | Reig C.;Munoz V.;Sochinskii NV. .Low-pressure synthesis and Bridgman growth of Hg1-xMnxTe[J].Journal of Crystal Growth,1999(3):688-693. |
[3] | Rogalski A .[J].Infrared Phys,1991,31(02):117-166. |
[4] | Price MW.;Lehoczky SL.;Szofran FR.;Su CH.;Scripa RN. .Directional solidification and characterization of Hg0.89Mn0.11Te[J].Journal of Crystal Growth,1999(Pt.1):297-302. |
[5] | Wall A;Caplle C;Franciosi A .[J].Journal of Vacuum Science and Technology,1986,A4(03):818-822. |
[6] | Kosyachenko L A;Ostapov S E;Markov A V et al.[J].Proceedings of Spie-the International Society For Optical Engineering,2003,5065:146-151. |
[7] | Wang Xiaoqin;Jie Wanqi;Li Qiang et al.[J].Materials Science in Semiconductor Processing,2005,8(06):615-621. |
[8] | Li Qiang;Jie Wanqi;Fu Li et al.[J].Nucl Instrum Methods Phys Res Sect A,2006,564:544-548. |
[9] | Huang Shihua;Lu Fang .[J].Applied Sueface Science,2006,252:4027-4032. |
[10] | Mead C A .[J].Solid-State Electronics,1966,9:1023-1033. |
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