采用导模法生长了a向,尺寸为60 mm ×5 mm ×300 mm的蓝宝石单晶片,采用化学腐蚀-金相显微镜法观测了其(0001)晶面的位错特征,并且采用INSTRON-1195万能试验机测试了抛光样品的弯曲强度.结果显示:当晶体中位错缺陷分布均匀时,在外部弯曲应力下,蓝宝石晶体发生特定晶面的高强解理断裂,位错密度的升高对蓝宝石弯曲强度没有明显损害作用.然而当晶体中出现位错密排结构时,蓝宝石单晶常温弯曲强度迅速下降.
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