通过分析时效期间Cu-Ni-Si合金显微硬度、导电率以及微观组织的变化,研究了析出相和再结晶行为的相互作用.结果表明,时效初期析出相对随后的再结晶过程具有强烈阻碍作用.在450、550℃较低温度时效时,合金发生原位再结晶,析出相在其体积分数略微升高或不变的情况下发生粗化;导电率上升趋势为先快后慢并趋于稳定,因而其变化曲线上无峰值出现;显微硬度则由于时效后期析出颗粒粗化,析出强化效果降低而出现峰值.在750℃高温时效时,合金发生不连续再结晶,析出相则在体积分数略有降低的情况下发生粗化;导电率先快速上升后缓慢下降因而出现峰值;而显微硬度由于析出物迅速粗化而一开始就表现为持续下降.
By analyzing the change of microhardness, electric conductivity and microstructure of Cu-Ni-Si ahoy during aging, the interaction between precipitated phase and recrystallization was studied. Results show that precipitates phase in early aging stage can strongly prevent recrystallization. When aging at 450℃ and 550℃, recrystallization in site occurred,and precipitates phase grew with no significant change of its volume fraction. Electric conductivity monotonously increased and microhardness increased first to a maximum value and then decreased for the alloy with increasing aging time. When aging at 750 ℃, discontinuous recrystallization occurred,and precipitates phase with slightly decreasing of its volume fraction as aging time increased. However, a peak in curve of electric conductivity vs. aging time is observed and microhardness decreased continuously for the alloy with increase of aging time.
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