微波介质陶瓷TiO2的低温烧结研究进展

材料导报, 2004, 18(11): 81-83.

微波介质陶瓷TiO2的低温烧结研究进展

谢述锋 ^1, , 王春娟 ^2, , 刘向春 ^3, , 李光耀 ^4, , 田长生 ^5,

1.西北工业大学材料科学与工程学院,西安,710072

2.西北工业大学材料科学与工程学院,西安,710072

3.西北工业大学材料科学与工程学院,西安,710072

4.西北工业大学材料科学与工程学院,西安,710072

5.西北工业大学材料科学与工程学院,西安,710072

基金项目: 航空基础科学基金(02G53044)

关键词： TiO2 , 多层微波元件 , 低温烧结 , 液相烧结

Development of Low Temperature Sintering of TiO2 System Microwave Dielectric Ceramic

在制备多层微波元件过程中,从环保及制作成本方面考虑,为使用熔点较低的Ag(td=960℃)或Cu(td=1060℃)等贱金属作为电极材料,必须降低介质陶瓷的烧结温度;介绍了几类通过液相烧结降低致密化温度的TiO2基微波介质陶瓷,该类陶瓷的烧结温度已降至1000℃以下,并具有较好的应用前景.

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微波介质陶瓷TiO2的低温烧结研究进展

Development of Low Temperature Sintering of TiO2 System Microwave Dielectric Ceramic

参考文献