随着当代电子封装技术的飞速发展以及无铅化潮流的兴起,倒装芯片中凸点(Solder Bump)与凸点下金属层(UBM)之间的反应的研究成为当前研究的热点.综述了UBM与凸点反应研究的最新进展,总结了钎焊过程中的界面反应和元素扩散行为,分析了界面金属间化合物层(IMC)在长时间回流焊接过程中剥落的原因,进一步指出了凸点与UBM反应研究的趋势.
参考文献
| [1] | Winkler S .Advanced IC packaging markets and trends[J].Solid State Technology,2001,44:47. |
| [2] | Kelkar N.;Mathew R.;Takiar H.;Nguyen L. .MicroSMD-a wafer level chip scale package[J].IEEE transactions on advanced packaging,2000(2):227-232. |
| [3] | TU K N;Gusak A M;Li M.Applied physics rviewsrocused review[J].Applied Physics Letters,2003(93):1335. |
| [4] | LI M;Zhang F;Chen W T et al.Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni V/Cu thin films[J].Journal of Materials Research,2002,17(07):1612. |
| [5] | Zeng K;Tu K N .Six cases of reliability study of Pb-free solder joints in electronic packing technology[J].Materials Science and Engineering,2002,38:55. |
| [6] | TU K N;Zeng K .Tin-lead SnPb solder reaction in flip chip technology[J].Materials Science and Engineering,2001,34:1. |
| [7] | Balkan H;Sanchez J;Burgess G.Flip chip technology workshop[M].Austin TX,2001:426. |
| [8] | liu Yudong;Tan Zhimin;Qian Zhiyong et al.Fabrication of Pb/Sn Bumps[J].Electronic Conpo Mater,2002,21:4. |
| [9] | Liu C Y;Tu K N .Morphology of wetting reaction of SnPb alloys on Cu as a function of alloy composition[J].Journal of Materials Research,1998,13(01):37. |
| [10] | Ohtani H;Okuda K;Ishida K.[J].Journal of Phase Equilibria:416. |
| [11] | ShimJ H;Oh C S;Lee BJ et al.[J].Zeitschrift fur Metallkunde,1996,87:205. |
| [12] | Bolcavage A;Kao C R;Chen S L.Proceedings of ap plications of thermodynamics in the synthesis and processing of materials[M].Rosemont IL,1995:171. |
| [13] | Hayes F H;Lukas H L;Effenberg G et al.[J].Zeitschrift fur Metallkunde,1986,77:749. |
| [14] | Oh C S;Shim J H;Lee B J.[J].Journal of Alloys and Compounds,1996:155. |
| [15] | Moon K W;Boettinger W J;Kattner U R.[J].JOURNAL OF ELECTRONIC MATERIALS,2000:1122. |
| [16] | Liu C Y;Tu K N;Sheng T T.[J].Journal of Applied Physics,2000:750. |
| [17] | Zhang F;Li M;Chum C C.[J].JOURNAL OF ELECTRONIC MATERIALS,2003(03):123. |
| [18] | Jang J W;Kim P G;Tu K N et al.Solder reaction-assisted crystallization of electroless Ni-P under-bump-metallization in low cost flip chip technology[J].Journal of Applied Physics,1999,85(12):8456. |
| [19] | Jeon Y D;Paik K W;Bok K S.Studies on Ni-Sn Intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability[A].Orlando FL Pisca taway USA IEEE,2001:29. |
| [20] | Chen C J;Lin K L .The reaction between electroless Ni-CuP deposit and 63Sn-37Pb flip chip solder bumps during reflow[J].Journal of Electronic Materials,2000,29(08):1007. |
| [21] | Hung K C;Chan Y C;Tang C W et al.Correlation between Ni3 Sn4 intermetallics and Ni3P due to solder reactionassisted crystallization of electroless Ni-P metallization in advanced package[J].Journal of Materials Research,2000,15(11):2534. |
| [22] | Hung KC.;Chan YC. .Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization[J].Journal of Materials Science Letters,2000(19):1755-1757. |
| [23] | Liu P;Xu Z;Shang J K .Thermal stability of electrolessNi/solder interfaces.Part A.Interfacial chemistry and microstructure[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,2000,31:2857. |
| [24] | Jang Seyang;Kyung Wook Paik .Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems[J].IEEE transactions on electronics packaging manufacturing,2001,24(04):269. |
| [25] | Se-Young Jang;Juergen Wolf;Kyung-Wook Paik .Under bump metallurgy study for Pb-free bumping[J].Journal of Electronic Materials,2002(5):478-487. |
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