组合材料芯片技术是近几年发展起来的一种快速发现、优化和筛选新型功能材料的方法.要充分发挥其在无机功能材料研究领域的优势,必须解决3个问题:①材料芯片的设计;②材料芯片的高速并行制备;③材料芯片的快速表征.其中材料芯片的制备是整个技术应用的前提,开发适用于高密度材料芯片制备的技术有着非常重大的意义.综述了无机功能材料芯片新的制备方法--物理气相顺序沉积,并简述了相关设备的特点和功能.
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