对电子封装IGBT功率模块进行热循环实验， 考察 了92.5Pb5Sn2.5Ag钎料焊层的热循 环失效和裂纹扩展。 应用超声波显微镜对裂纹扩展过程进行检测， 得到了热循环失效的裂 纹 扩展数据。 采用统一型粘塑性Anand方程描述了92.5Pb5Sn2.5Ag的力学本构， 模拟了功率 模 块钎料焊层裂纹体在热循环条件下的应力应变。 基于对ΔJ积分的求解， 描述了PbSn Ag焊层热循环裂纹扩展速率。
By applying thermal cycling tests to the IGBT p ower modules， the therma l fatigue and crack propagation of 92.5Pb5Sn2.5Ag solder layer were investig ated . The crack propagation process in solder layer was inspected with C-mode scann i ng acoustic microscope (CSAM) and the crack propagation data were also measured. By employing the unified viscoplastic Anand constitutive equation to represents the deformation behavior of 92.5Pb5Sn2.5Ag solder， the stress/strain response s of the power modules with crack in PbSnAg solder layer under thermal cycling wer e simulated with finite element method. Moreover， the crack propagation rate o f PbSnAg solder layer under thermal cycling was described based on the calculation of mechanical parameter ΔJ integral.
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