对不同环氧树脂的熔融黏度(150℃)进行了分析,结果表明,联苯型环氧树脂(TMBP)熔融黏度极低(0.02 Pa·s),用TMBP与邻甲酚醛环氧树脂(ECN)共混,可大大降低ECN的黏度.硅微粉含量和粒径对环氧树脂复合材料流动行为有较大的影响.随着硅微粉含量的增加,体系的熔融黏度大大增加.高硅微粉含量的体系,其熔融黏度在低剪切速率下,呈现"剪切变稀",在较高剪切速率下呈现"剪切变稠",而在高剪切速率下又表现为"剪切变稀";小粒径硅微粉填充体系在低剪切速率下黏度小,而在高剪切速率下黏度大,大粒径硅微粉填充体系正好与此相反.
The melting viscosities(η_a) of different kinds of epoxy resins was investigated.The results show that cresol novolac epoxy resin(ECN) in order to decrease η_a of epoxy molding composite(EMC).The effects of the content, particle size of silica on the flowability of EMC were researched systematically.The results show that η_a of system with higher content of silica changes complicatedly with increasing of shear rate(γ), i.e., η_a decreases with increasing of γ in the range of low γ, then increases with increasing of in the range of high γ, but decreases again with increasing of γ in the range of higher γ.The system filled by silica with small particle diameter has low η_a at low γ and high η_a at high γ, but η_a of the system filled by silica with large particle diameter changes on the contrary.
参考文献
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